Senior Staf Package Engineer

General Information

Job Name

Senior Staf Package Engineer

Country/Region

Korea, Republic of

State

Seoul

City

Seoul

Work Location

Seoul Office

Exemption Status

Exempt

Business Function

Packaging Engineering

Employment Type

Full-time

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Description

Job Summary

Join the Advanced 3D Packaging technology team driving next-generation memory packaging solutions for AI inference in data center, mobile and other platforms. We have many roles with different job responsibility areas described below. Job roles include: module engineering/integration, process technology integration, materials & equipment integration, yield and reliability analysis. The roles include managing specific technology areas through technology/product development and qualifications

Key Responsibilities

• Develop and optimize advanced packaging processes: high-layer-count NAND die stacking, TSV, micro-bump and Cu-Cu hybrid bonding, and base-die/logic-die integration.
• Lead process integration across wafer thinning, wafer-level packaging, RDL, substrate, assembly, and test for NAND die stacks.
• Lead advanced packaging design and product-level integration for multi-die stacks, balancing front-end and back-end constraints to optimize for product yield, cost, quality and manufacturability
• Evaluate and qualify advanced materials use in 3D Hybrid Package Integration.
• Partner with external sources such as Foundries and OSAT’s, substrate suppliers, equipment vendors, and material suppliers to accelerate technology maturity and multi-source readiness.
• Drive DOE, process characterization, yield learning, and reliability improvemenst.
• Support technology bring up from R&D to pilot line to high-volume manufacturing.
• Contribute to the advanced packaging technology roadmap and assess emerging 3D integration trends.

Required Qualifications

• MS or PhD in Materials Science, Electrical/Mechanical/Chemical Engineering, Physics, or related field.
• 5 to 7 + years’ experience in semiconductor process development/integration, design in the fields of advanced packaging and/or wafer processing
• Hands-on experience in one or more of: NAND or DRAM die stacking, TSV processing, hybrid bonding, wafer-level packaging (WLP/FOWLP), advanced substrate technology, or 2.5D/3D integration, materials integration
• Strong process integration fundamentals and data-driven problem solving (DOE, SPC, AI enhanced development methodologies)
• Experience working with third parties and suppliers such as OSATs, foundries, memory assembly/test operations, materials, FA/Test tools, Metrology etc

Preferred Qualifications

• Direct HBM, or high-layer-count 3D NAND packaging development experience.
• Package reliability, thermo-mechanical modeling, and failure analysis background.
• Track record taking a technology from concept through qualification to production.
• Operational Experience of transition a program from development in to manufacturing, including setting up of integrated development lines
• Experience leading global cross-functional teams and external development partners.
• Multi Lingual with English and Asian languages

Key Skills

2.5D/3D Packaging · TSV · Hybrid Bonding · Heterogeneous / advanced Wafer-Level Packaging · Process Integration · Advanced Materials · Package Reliability · DOE/SPC · OSAT · Technology Roadmap . FA . Yield Analytics

“General Job description to cover many specializations within Adv Packaging for HBF, as we will be looking for more than one candiate.”

Additional Information

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.